PolySurg™, PS04LTVA1 ESD Suppressor

PolySurg™, PS04LTVA1 ESD Suppressor

The PolySurg™ PS04LTVA ESD Suppressors protect valuable high-speed data circuits with sensitive ICs from ESD damage without distorting data signals as a result of its ultra-low (0.05pF typical) capacitance



Data Sheet #4083

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Catalog Number PS04LTVA1
Dimensions See Resources Tab
Rated Voltage 5Vdc typical, 12Vdc maximum
Clamping Voltage1 25V typical 1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30nS after initiation of pulse.
Trigger voltage2 150V typical 2. Trigger measurement made using Transmission Line Pulse (TLP) method.
Capacitance @ 1MHz 0.05pF typical, 0.15pF maximum
Attenuation change (0-20GHz) -0.2dB typical
Leakage current @ 12Vdc <0.1nA typical
ESD pulse withstand 1 >1000 pulses typical 1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30nS after initiation of pulse.


  • Low trigger voltage and clamping voltage delivers enhanced ESD protection of very sensitive ICs
  • Ultra-low capacitance (0.05pF typ.) ideal for high speed data applications
  • Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test
  • Single line, bidirectional device for placement flexibility
  • Low profile 0402/1005 design for board space savings
  • Low leakage current (<0.1nA typ.) reduces power consumption
  • RoHS compliant, halogen free and lead free for global acceptance
  • Tin-plated (Sn) version available
  • Tested to meet automotive specifications (AEC-Q200)

Device Marking

PolySurg™ ESD Suppressors are marked on the tape and reel packages, not individually. Since the product is bi-directional and symmetrical, no orientation marking is required.

Design Consideration

The location in the circuit for the LTV series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground).

Environmental Specifications:

  • High Temperature Exposure: MIL-STD-202 Method 108
  • Temperature Cycling: 1000 Air to Air cycles -40°C to +125°C JESD22 Method JA-104
  • Moisture Resistance Test: MIL-STD-202 Method 106G, 10 cycles
  • Biased Humidity: MIL-STD-202 Method 103, 1,000hours +85°C, 85%RH
  • Thermal Shock: MIL-STD-202, Method 107G Air-to-Air -55°C to +125°C, 10 cycles
  • Vibration Test and Mechanical Shock Test: MIL-STD-202 Method 204 and Method 213
  • Resistance to Solvent: MIL-STD-202 Method 215
  • Operating and Storage Temperature Range: -55°C to +125°C

Soldering Recommendations

  • Compatible with lead and lead-free solder reflow processes
  • Peak reflow temperatures and durations:

- IR Reflow = 260°C max for 10 sec. max

- Wave Solder = 260°C max. for 10 sec. max


  • Satellite / digital radio 
  • Security equipment
  • Mobile phones               
  • Broadband network equipment
  • GSM Modules                   
  • Other RF applications
  • HDTV Equipment            
  • High speed data ports
  • A/V Equipment - USB 2.0/3.0
  • DMB Modules - IEEE 1394
  • Test and measurement equipment - HDMI
  • Portable game systems - DVI
  • Personal media players - High speed Ethernet